Hybritech Composants Microelectroniques


With about 30 years of experience, HCM is one of the reputed Lab for microelectronic assemblies as well as qualification and fiabilisation of components. A QPL source for the packaging of bare dice from the world renowned manufacturers of Microelectronic components.

HCM is a market leader of the following activities.

  • Supplying of the qualified chips (lot accepted, probe tested)
  • Wafer and substrate sawing
  • Microelectronics assemblies like COB, SMD, Hybrid Modules etc.
  • Qualification and fabrication of the componenets for Military and space application according to ESA/SCC 5000 & 9000: ESA PSS-01-608; MIL-PRF-38584; MIL-S-19500 etc..

HCM Microelectronic assemblies included

  • Chip on Board
  • Chip on Chip
  • SMD assemblies
  • MEMS assemblies
  • Stud Ball Bumping
  • Sensor module assemblies
  • RF module assemblies
  • Hybrid module assemblies
  • Hybrid power module assemblies

HCM has a large availability of Dice and Ceramic Packages and can also undertake assembly of obsolete devices according to manufacturer’s specifications.

HCM’s main customers are Aerospatiale, Alcatel Space, Thales Alenia Space, Alsthom, Astrium, EADS, INDRA, ISRO, MBDA, SAFRAN, SORIN Group, THALES etc.